What is Cu clip package? copper per kg

Power chips are linked to outside circuits through packaging, and their efficiency relies on the assistance of the packaging. In high-power scenarios, power chips are normally packaged as power components. Chip affiliation refers to the electric connection on the upper surface area of the chip, which is typically aluminum bonding cord in standard modules. ^
Conventional power module plan cross-section

Currently, business silicon carbide power modules still primarily use the packaging innovation of this wire-bonded conventional silicon IGBT component. They deal with problems such as large high-frequency parasitic parameters, inadequate heat dissipation ability, low-temperature resistance, and inadequate insulation toughness, which limit using silicon carbide semiconductors. The display of excellent efficiency. In order to resolve these troubles and completely make use of the huge possible benefits of silicon carbide chips, several new packaging innovations and remedies for silicon carbide power components have emerged over the last few years.

Silicon carbide power module bonding method


(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding materials have actually established from gold cable bonding in 2001 to light weight aluminum wire (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have actually created from gold wires to copper cords, and the driving force is cost reduction; high-power tools have actually created from aluminum cables (strips) to Cu Clips, and the driving force is to enhance product performance. The better the power, the higher the needs.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that utilizes a solid copper bridge soldered to solder to link chips and pins. Compared with typical bonding product packaging techniques, Cu Clip innovation has the following benefits:

1. The link between the chip and the pins is made from copper sheets, which, to a certain degree, changes the basic cord bonding method between the chip and the pins. Therefore, a distinct package resistance worth, greater current flow, and much better thermal conductivity can be gotten.

2. The lead pin welding area does not need to be silver-plated, which can completely save the price of silver plating and bad silver plating.

3. The product appearance is totally regular with normal products and is generally used in web servers, portable computer systems, batteries/drives, graphics cards, electric motors, power materials, and various other areas.

Cu Clip has 2 bonding approaches.

All copper sheet bonding method

Both the Gate pad and the Resource pad are clip-based. This bonding method is much more costly and complicated, but it can achieve better Rdson and better thermal effects.


( copper strip)

Copper sheet plus cable bonding method

The resource pad uses a Clip approach, and eviction utilizes a Cord approach. This bonding technique is slightly cheaper than the all-copper bonding technique, conserving wafer area (suitable to very tiny entrance areas). The process is easier than the all-copper bonding technique and can get much better Rdson and better thermal result.

Vendor of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper per kg, please feel free to contact us and send an inquiry.

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